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Plasma etch challenges of Directed Self-Assembly (DSA) for fin and contact holes patterning in 7nm (N7) technology node

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dc.contributor.authorChan, BT
dc.contributor.authorSayan, Safak
dc.contributor.authorBekaert, Joost
dc.contributor.authorDoise, Jan
dc.contributor.authorGronheid, Roel
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorXu, Kaidong
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorBekaert, Joost
dc.contributor.imecauthorDoise, Jan
dc.contributor.imecauthorGronheid, Roel
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.contributor.orcidimecBekaert, Joost::0000-0003-3075-3479
dc.date.accessioned2021-10-22T00:54:12Z
dc.date.available2021-10-22T00:54:12Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23623
dc.source.conference40th International Conference on Micro and Nano Engineering - MNE
dc.source.conferencedate23/09/2014
dc.source.conferencelocationLausanne Switzerland
dc.title

Plasma etch challenges of Directed Self-Assembly (DSA) for fin and contact holes patterning in 7nm (N7) technology node

dc.typeMeeting abstract
dspace.entity.typePublication
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