Publication:
300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections
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2117 since deposited on 2021-10-23
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Acq. date: 2026-04-28
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Statistics
Views
2117 since deposited on 2021-10-23
2last month
1last week
Acq. date: 2026-04-28
Citations