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300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections

Date

2016
Meeting abstract
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dc.contributor.authorJourdan, Nicolas
dc.contributor.authorCellier, Daniel
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorCellier, Daniel
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned2021-10-23T11:35:37Z
dc.date.available2021-10-23T11:35:37Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26792
dc.source.conferenceMaterials for Advanced Metallization Conference - MAM
dc.source.conferencedate20/03/2016
dc.source.conferencelocationBrussels Belgium
dc.title

300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections

dc.typeMeeting abstract
dspace.entity.typePublication
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