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Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
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Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
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Date
2009
Proceedings Paper
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17744.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Heylen, Nancy
;
Li, Yunlong
;
Kellens, Kristof
;
Travaly, Youssef
;
Vereecke, Guy
;
Volders, Henny
;
Tokei, Zsolt
;
Versluijs, Janko
;
Rip, Jens
;
Van Besien, Els
;
Carbonell, Laure
;
Beyer, Gerald
;
Fischer, Paul
;
Zhao, Larry
;
Santoro, Gaetano
;
Cockburn, Andrew
;
Nguyen, Olivier
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Abstract
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1991
since deposited on 2021-10-17
Acq. date: 2025-12-10
Citations
Metrics
Views
1991
since deposited on 2021-10-17
Acq. date: 2025-12-10
Citations