Publication:

Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour

Date

2009
Proceedings Paper
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dc.contributor.authorHeylen, Nancy
dc.contributor.authorLi, Yunlong
dc.contributor.authorKellens, Kristof
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVereecke, Guy
dc.contributor.authorVolders, Henny
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVersluijs, Janko
dc.contributor.authorRip, Jens
dc.contributor.authorVan Besien, Els
dc.contributor.authorCarbonell, Laure
dc.contributor.authorBeyer, Gerald
dc.contributor.authorFischer, Paul
dc.contributor.authorZhao, Larry
dc.contributor.authorSantoro, Gaetano
dc.contributor.authorCockburn, Andrew
dc.contributor.authorNguyen, Olivier
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorRip, Jens
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSantoro, Gaetano
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.date.accessioned2021-10-17T22:51:36Z
dc.date.available2021-10-17T22:51:36Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15468
dc.source.beginpage415
dc.source.conferenceAdvanced Metallization Conference 2008 (AMC2008)
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage429
dc.title

Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour

dc.typeProceedings paper
dspace.entity.typePublication
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