Factors affecting an efficient sealing of porous low-K dielectrics by physical vapor deposition Ta(N) thin films

dc.contributor.author	Iacopi, Francesca
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Le, Quoc Toan
dc.contributor.author	Shamiryan, Denis
dc.contributor.author	Conard, Thierry
dc.contributor.author	Brijs, Bert
dc.contributor.author	Kreissig, U.
dc.contributor.author	Van Hove, Marleen
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Le, Quoc Toan
dc.contributor.imecauthor	Conard, Thierry
dc.contributor.imecauthor	Maex, Karen
dc.contributor.orcidimec	Le, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimec	Conard, Thierry::0000-0002-4298-5851
dc.date.accessioned	2021-10-14T21:52:05Z
dc.date.available	2021-10-14T21:52:05Z
dc.date.issued	2002
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/6419
dc.source.beginpage	1548
dc.source.endpage	1554
dc.source.issue	3
dc.source.journal	Journal of Applied Physics
dc.source.volume	92
dc.title	Factors affecting an efficient sealing of porous low-K dielectrics by physical vapor deposition Ta(N) thin films
dc.type	Journal article
dspace.entity.type	Publication
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