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A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon
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A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon
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Date
2017
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Herms, Martin
;
Wagner, Matthias
;
De Messemaeker, Joke
;
De Wolf, Ingrid
Journal
Physica Status Solidi C
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1838
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Acq. date: 2025-12-15
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Metrics
Views
1838
since deposited on 2021-10-24
2
last month
Acq. date: 2025-12-15
Citations