A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon

dc.contributor.author	Herms, Martin
dc.contributor.author	Wagner, Matthias
dc.contributor.author	De Messemaeker, Joke
dc.contributor.author	De Wolf, Ingrid
dc.contributor.imecauthor	De Messemaeker, Joke
dc.contributor.imecauthor	De Wolf, Ingrid
dc.contributor.orcidimec	De Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned	2021-10-24T05:37:48Z
dc.date.available	2021-10-24T05:37:48Z
dc.date.embargo	9999-12-31
dc.date.issued	2017
dc.identifier.issn	1610-1634
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/28490
dc.identifier.url	http://onlinelibrary.wiley.com/doi/10.1002/pssc.201700028/full
dc.source.beginpage	1700028
dc.source.issue	7
dc.source.journal	Physica Status Solidi C
dc.source.volume	14
dc.title	A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon
dc.type	Journal article
dspace.entity.type	Publication
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