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Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN
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1913 since deposited on 2021-10-21
1last month
Acq. date: 2025-12-09
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Metrics
Views
1913 since deposited on 2021-10-21
1last month
Acq. date: 2025-12-09
Citations