Publication:
Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN
Date
| dc.contributor.author | Sun, Yiting | |
| dc.contributor.author | Levrau, Elisabeth | |
| dc.contributor.author | Blauw, Michiel | |
| dc.contributor.author | Meersschaut, Johan | |
| dc.contributor.author | Verdonck, Patrick | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Detavernier, Chrostophe | |
| dc.contributor.author | Baklanov, Mikhaïl | |
| dc.contributor.author | De Feyter, Steven | |
| dc.contributor.author | Armini, Silvia | |
| dc.contributor.imecauthor | Sun, Yiting | |
| dc.contributor.imecauthor | Levrau, Elisabeth | |
| dc.contributor.imecauthor | Meersschaut, Johan | |
| dc.contributor.imecauthor | Verdonck, Patrick | |
| dc.contributor.imecauthor | Struyf, Herbert | |
| dc.contributor.imecauthor | Armini, Silvia | |
| dc.contributor.orcidimec | Meersschaut, Johan::0000-0003-2467-1784 | |
| dc.contributor.orcidimec | Verdonck, Patrick::0000-0003-2454-0602 | |
| dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
| dc.contributor.orcidimec | Levrau, Elisabeth::0000-0002-5305-8041 | |
| dc.contributor.orcidimec | Struyf, Herbert::0000-0002-6782-5424 | |
| dc.date.accessioned | 2021-10-21T12:29:19Z | |
| dc.date.available | 2021-10-21T12:29:19Z | |
| dc.date.issued | 2013 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23138 | |
| dc.source.beginpage | AA05.22 | |
| dc.source.conference | Advanced Interconnects for Micro- and Nanoelectronics - Materials, Processes, and Reliability | |
| dc.source.conferencedate | 1/04/2013 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.title | Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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