Publication:

Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm

Date

2009
Proceedings Paper
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dc.contributor.authorVolders, Henny
dc.contributor.authorRichard, Olivier
dc.contributor.authorCarbonell, Laure
dc.contributor.authorPalmans, Roger
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorHeylen, Nancy
dc.contributor.authorKellens, Kristof
dc.contributor.authorArmini, Silvia
dc.contributor.authorBender, Hugo
dc.contributor.authorZhao, Larry
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-18T04:59:44Z
dc.date.available2021-10-18T04:59:44Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16503
dc.source.beginpage237
dc.source.conferenceAdvanced Metallization Conference 2008 (AMC 2008)
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage242
dc.title

Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm

dc.typeProceedings paper
dspace.entity.typePublication
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