Publication:

Hydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection

Date

2020
Journal article
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dc.contributor.authorZheng, Li
dc.contributor.authorWang, C.
dc.contributor.authorCai, D.
dc.contributor.authorHuang, Y.
dc.contributor.authorAdi, K.
dc.contributor.authorHong, Y.
dc.contributor.authorChen, Y.
dc.contributor.authorZhou, G.
dc.contributor.authorArmini, Silvia
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorWang, Shouxu
dc.contributor.authorHe, Wei
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-29T09:02:00Z
dc.date.available2021-10-29T09:02:00Z
dc.date.issued2020
dc.identifier.issn1867-1070
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36411
dc.identifier.urlhttps://doi.org/10.1016/j.jtice.2020.07.004
dc.source.beginpage130
dc.source.endpage136
dc.source.journalJournal of the Taiwan Institute of Chemical Engineers
dc.source.volume112
dc.title

Hydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection

dc.typeJournal article
dspace.entity.typePublication
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