Publication:

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Date

2021
Proceedings Paper
https://doi.org/10.1117/12.2582975
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Author(s)

Joa, Gaehun
;
Edinger, Pierre
;
Bleiker, Simon J.
;
Wang, Xiaojing
;
Takabayashi, Alain Yuji
;
Sattari, Hamed
;
Quack, Niels
;
Jezzini, Moises
;
Verheyen, Peter
;
Stemme, Goran
;
Bogaerts, Wim  
;
Gylfason, Kristinn B.
;
Niklaus, Frank

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na

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230 since deposited on 2022-03-16
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