Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Joa, Gaehun; Edinger, Pierre; Bleiker, Simon J.; Wang, Xiaojing; Takabayashi, Alain Yuji; Sattari, Hamed; Quack, Niels; Jezzini, Moises; Verheyen, Peter; Stemme, Goran; Bogaerts, Wim; Gylfason, Kristinn B.; Niklaus, Frank

doi:10.1117/12.2582975

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Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

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2021

Proceedings Paper

https://doi.org/10.1117/12.2582975

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Takabayashi, Alain Yuji

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Gylfason, Kristinn B.

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Niklaus, Frank

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Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

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