Publication:

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Date

2021
Proceedings Paper
https://doi.org/10.1117/12.2582975
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dc.contributor.authorJoa, Gaehun
dc.contributor.authorEdinger, Pierre
dc.contributor.authorBleiker, Simon J.
dc.contributor.authorWang, Xiaojing
dc.contributor.authorTakabayashi, Alain Yuji
dc.contributor.authorSattari, Hamed
dc.contributor.authorQuack, Niels
dc.contributor.authorJezzini, Moises
dc.contributor.authorVerheyen, Peter
dc.contributor.authorStemme, Goran
dc.contributor.authorBogaerts, Wim
dc.contributor.authorGylfason, Kristinn B.
dc.contributor.authorNiklaus, Frank
dc.contributor.imecauthorBogaerts, Wim
dc.contributor.orcidimecBogaerts, Wim::0000-0003-1112-8950
dc.date.accessioned2022-03-16T15:14:31Z
dc.date.available2022-03-16T15:14:31Z
dc.date.issued2021
dc.identifier.doi10.1117/12.2582975
dc.identifier.eisbn978-1-5106-4218-8
dc.identifier.isbn978-1-5106-4217-1
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39466
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.conferenceConference on Silicon Photonics XVI
dc.source.conferencedateMAR 06-11, 2021
dc.source.conferencelocationVirtual
dc.source.journalna
dc.source.numberofpages7
dc.source.volume11691
dc.title

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

dc.typeProceedings paper
dspace.entity.typePublication
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