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New slurry formulation for copper-CMP process in a damascene integration scheme

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dc.contributor.authorTerzieva, Valentina
dc.contributor.authorSijmus, Bram
dc.contributor.authorMeuris, Marc
dc.contributor.authorPuppe, Lothar
dc.contributor.authorPassing, Gerd
dc.contributor.imecauthorTerzieva, Valentina
dc.contributor.imecauthorMeuris, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-10-14T23:20:53Z
dc.date.available2021-10-14T23:20:53Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6876
dc.source.beginpageI3.4
dc.source.conferenceChemical-Mechanical Planarization
dc.source.conferencedate1/04/2002
dc.source.conferencelocationSan Francisco, CA USA
dc.title

New slurry formulation for copper-CMP process in a damascene integration scheme

dc.typeProceedings paper
dspace.entity.typePublication
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