Publication:
Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes
Date
| dc.contributor.author | De Pauw, Herbert | |
| dc.contributor.author | De Baets, Johan | |
| dc.contributor.author | Vanfleteren, Jan | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.imecauthor | De Pauw, Herbert | |
| dc.contributor.imecauthor | De Baets, Johan | |
| dc.contributor.imecauthor | Vanfleteren, Jan | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
| dc.date.accessioned | 2021-10-15T04:23:02Z | |
| dc.date.available | 2021-10-15T04:23:02Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7444 | |
| dc.source.conference | International Electronic Packaging Technical Conference and Exhibition | |
| dc.source.conferencedate | 6/07/2003 | |
| dc.source.conferencelocation | Maui, HI USA | |
| dc.title | Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |