Publication:
Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects
Date
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Jacobs, Kristof J.P. | |
| dc.contributor.author | Orozco, Antonio | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Jacobs, Kristof J.P. | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Jacobs, Kristof J.P.::0000-0002-1081-3633 | |
| dc.date.accessioned | 2021-10-28T21:09:19Z | |
| dc.date.available | 2021-10-28T21:09:19Z | |
| dc.date.issued | 2020 | |
| dc.identifier.issn | 0026-2714 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/35010 | |
| dc.identifier.url | https://doi.org/10.1016/j.microrel.2020.113780 | |
| dc.source.beginpage | 113780 | |
| dc.source.journal | Microelectronics Reliability | |
| dc.source.volume | 114 | |
| dc.title | Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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