Publication:

Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding

Date

2024
Proceedings Paper
https://doi.org/10.1117/12.3008658
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Published version 1.19 MB

Author(s)

Kasai, Hiroaki
;
Osaki, Mayuka
;
Hasumi, Kazuhisa
;
Mise, Nobuyuki
;
Tanaka, Maki
;
Tunca Altintas, Bensu  
;
Chew, Soon Aik  
;
Bogdanowicz, Janusz  
;
Moussa, Alain  
;
Saib, Mohamed  
;
Zhang, Boyao  
;
Charley, Anne-Laure  

Journal

Proceedings of SPIE

Abstract

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401 since deposited on 2024-06-15
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650 since deposited on 2024-06-15
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Acq. date: 2026-02-26

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