Publication:

Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding

Date

2024
Proceedings Paper
https://doi.org/10.1117/12.3008658
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dc.contributor.authorKasai, Hiroaki
dc.contributor.authorOsaki, Mayuka
dc.contributor.authorHasumi, Kazuhisa
dc.contributor.authorMise, Nobuyuki
dc.contributor.authorTanaka, Maki
dc.contributor.authorTunca Altintas, Bensu
dc.contributor.authorChew, Soon Aik
dc.contributor.authorBogdanowicz, Janusz
dc.contributor.authorMoussa, Alain
dc.contributor.authorSaib, Mohamed
dc.contributor.authorZhang, Boyao
dc.contributor.authorCharley, Anne-Laure
dc.contributor.imecauthorChew, Soon Aik
dc.contributor.imecauthorBogdanowicz, Janusz
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorSaib, Mohamed
dc.contributor.imecauthorZhang, Boyao
dc.contributor.imecauthorCharley, Anne-Laure
dc.contributor.imecauthorTunca Altintas, Bensu
dc.contributor.orcidimecChew, Soon Aik::0000-0003-3013-4846
dc.contributor.orcidimecBogdanowicz, Janusz::0000-0002-7503-8922
dc.contributor.orcidimecMoussa, Alain::0000-0002-6377-4199
dc.contributor.orcidimecSaib, Mohamed::0000-0002-5153-5553
dc.contributor.orcidimecZhang, Boyao::0000-0002-7976-0146
dc.contributor.orcidimecCharley, Anne-Laure::0000-0003-4745-0167
dc.contributor.orcidimecTunca Altintas, Bensu::0000-0001-8611-3636
dc.date.accessioned2024-08-26T09:55:26Z
dc.date.available2024-06-15T17:25:28Z
dc.date.available2024-08-26T09:55:26Z
dc.date.embargo2024-04-09
dc.date.issued2024
dc.identifier.doi10.1117/12.3008658
dc.identifier.eisbn978-1-5106-7217-8
dc.identifier.isbn978-1-5106-7216-1
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44046
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpageArt. 129551N
dc.source.conferenceConference on Metrology, Inspection, and Process Control XXXVIII
dc.source.conferencedateFEB 26-29, 2024
dc.source.conferencelocationSan Jose
dc.source.journalProceedings of SPIE
dc.source.numberofpages9
dc.source.volume12955
dc.title

Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding

dc.typeProceedings paper
dspace.entity.typePublication
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