Publication:

Insights into Scaled Logic Devices Connected from Both Wafer Sides

Date

2022
Proceedings Paper
https://doi.org/10.1109/IEDM45625.2022.10019521
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dc.contributor.authorVeloso, Anabela
dc.contributor.authorEneman, Geert
dc.contributor.authorMatagne, Philippe
dc.contributor.authorVermeersch, Bjorn
dc.contributor.authorJourdain, Anne
dc.contributor.authorArimura, Hiroaki
dc.contributor.authorO'Sullivan, Barry
dc.contributor.authorChen, Rongmei
dc.contributor.authorDe Keersgieter, An
dc.contributor.authorSimoen, Eddy
dc.contributor.authorRadisic, Dunja
dc.contributor.authorOniki, Yusuke
dc.contributor.authorLafitte, A.
dc.contributor.authorBrus, Stephan
dc.contributor.authorBeyne, Eric
dc.contributor.authorDentoni Litta, Eugenio
dc.contributor.authorHoriguchi, Naoto
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorMatagne, Philippe
dc.contributor.imecauthorVermeersch, Bjorn
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorArimura, Hiroaki
dc.contributor.imecauthorO'Sullivan, Barry
dc.contributor.imecauthorChen, Rongmei
dc.contributor.imecauthorDe Keersgieter, An
dc.contributor.imecauthorSimoen, Eddy
dc.contributor.imecauthorRadisic, Dunja
dc.contributor.imecauthorOniki, Yusuke
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDentoni Litta, Eugenio
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecVermeersch, Bjorn::0000-0001-8640-672X
dc.contributor.orcidimecO'Sullivan, Barry::0000-0002-9036-8241
dc.contributor.orcidimecDe Keersgieter, An::0000-0002-5527-8582
dc.contributor.orcidimecSimoen, Eddy::0000-0002-5218-4046
dc.contributor.orcidimecOniki, Yusuke::0000-0002-6619-1327
dc.contributor.orcidimecBrus, Stephan::0000-0003-3554-0640
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDentoni Litta, Eugenio::0000-0003-0333-376X
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.accessioned2023-06-01T14:26:07Z
dc.date.available2023-05-25T20:20:23Z
dc.date.available2023-06-01T14:26:07Z
dc.date.issued2022
dc.identifier.doi10.1109/IEDM45625.2022.10019521
dc.identifier.eisbn978-1-6654-8959-1
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41629
dc.publisherIEEE
dc.source.conferenceInternational Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 03-07, 2022
dc.source.conferencelocationSan Francisco
dc.source.journalna
dc.source.numberofpages4
dc.title

Insights into Scaled Logic Devices Connected from Both Wafer Sides

dc.typeProceedings paper
dspace.entity.typePublication
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