Publication:

Development of a new metallization scheme for making nanoscale interconnects based on plasma-functionalization and electroless deposition

Date

 
dc.contributor.authorDictus, Dries
dc.contributor.authorDordi, Y.
dc.contributor.authorGurer, E.
dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorCarbonell, Laure
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.date.accessioned2021-10-21T07:20:27Z
dc.date.available2021-10-21T07:20:27Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22269
dc.source.beginpage261
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate11/03/2013
dc.source.conferencelocationLeuven Belgium
dc.source.endpage262
dc.title

Development of a new metallization scheme for making nanoscale interconnects based on plasma-functionalization and electroless deposition

dc.typeMeeting abstract
dspace.entity.typePublication
Files

Original bundle

Name:
26804.pdf
Size:
1.2 MB
Format:
Adobe Portable Document Format
Publication available in collections: