Publication:

3D system integration using through-Si via technologies. Definitions, roadmaps, technical challenges and solutions to economical barriers

Date

2009
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T21:23:19Z
dc.date.available2021-10-17T21:23:19Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14992
dc.source.conference4th IMPACT Conference & International 3D IC Conference
dc.source.conferencedate21/10/2009
dc.source.conferencelocationTaipei Taiwan
dc.title

3D system integration using through-Si via technologies. Definitions, roadmaps, technical challenges and solutions to economical barriers

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
19573.pdf
Size:
13.53 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions