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Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma

Date

2002
Journal article
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dc.contributor.authorShamiryan, Denis
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-14T23:08:49Z
dc.date.available2021-10-14T23:08:49Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6820
dc.source.beginpage1923
dc.source.endpage1928
dc.source.issue5
dc.source.journalJournal of Vacuum Science & Technology B
dc.source.volume20
dc.title

Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma

dc.typeJournal article
dspace.entity.typePublication
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