New Standard-under-Development for Chiplet Interconnect Test and Repair: IEEE Std P3405

dc.contributor.author	Marinissen, Erik Jan
dc.contributor.author	Evans, Adrian
dc.contributor.author	Chuang, Po-Yao
dc.contributor.author	Keim, Martin
dc.contributor.author	Chandra, Anshuman
dc.contributor.imecauthor	Marinissen, Erik Jan
dc.contributor.imecauthor	Chuang, Po-Yao
dc.contributor.orcidimec	Marinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimec	Chuang, Po-Yao::0000-0001-7325-8836
dc.date.accessioned	2025-08-25T12:48:12Z
dc.date.available	2024-08-23T17:30:06Z
dc.date.available	2025-08-25T12:48:12Z
dc.date.issued	2024
dc.identifier.doi	10.1109/ETS61313.2024.10567355
dc.identifier.eisbn	979-8-3503-4932-0
dc.identifier.isbn	979-8-3503-4933-7
dc.identifier.issn	1530-1877
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/44360
dc.publisher	IEEE
dc.source.conference	IEEE European Test Symposium (ETS)
dc.source.conferencedate	MAY 20-24, 2024
dc.source.conferencelocation	Hague
dc.source.journal	N/A
dc.source.numberofpages	10
dc.title	New Standard-under-Development for Chiplet Interconnect Test and Repair: IEEE Std P3405
dc.type	Proceedings paper
dspace.entity.type	Publication
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