Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking

Publication:

2013

Proceedings Paper

Author(s)

Rebibis, Kenneth June

;

Capuz, Giovanni

;

Daily, Robert

;

Gerets, Carine

;

Duval, Fabrice

;

Wang, Teng

;

;

;

;

;

1918 since deposited on 2021-10-21

Acq. date: 2026-02-27