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Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking
Publication:
Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking
Date
2013
Proceedings Paper
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28008.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Rebibis, Kenneth June
;
Capuz, Giovanni
;
Daily, Robert
;
Gerets, Carine
;
Duval, Fabrice
;
Wang, Teng
;
Struyf, Herbert
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
;
Swinnen, Bart
Journal
Abstract
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1914
since deposited on 2021-10-21
Acq. date: 2025-10-27
Citations
Metrics
Views
1914
since deposited on 2021-10-21
Acq. date: 2025-10-27
Citations