Publication:

Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking

Date

2013
Proceedings Paper
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dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDaily, Robert
dc.contributor.authorGerets, Carine
dc.contributor.authorDuval, Fabrice
dc.contributor.authorWang, Teng
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T11:20:08Z
dc.date.available2021-10-21T11:20:08Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22987
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6745697
dc.source.beginpage124
dc.source.conference15th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate11/12/2013
dc.source.conferencelocationSingapore Singapore
dc.source.endpage129
dc.title

Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking

dc.typeProceedings paper
dspace.entity.typePublication
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