The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay

dc.contributor.author	Mouraille, Orion
dc.contributor.author	van Haren, Richard
dc.contributor.author	Steinert, Steffen
dc.contributor.author	D'have, Koen
dc.contributor.author	Van Dijk, Leon
dc.contributor.author	Hermans, Jan
dc.contributor.author	Beyer, Dirk
dc.contributor.imecauthor	van Haren, Richard
dc.contributor.imecauthor	D'have, Koen
dc.contributor.imecauthor	Hermans, Jan
dc.contributor.orcidimec	D'have, Koen::0000-0002-5195-9241
dc.contributor.orcidimec	Hermans, Jan::0000-0003-1249-8902
dc.date.accessioned	2021-10-27T14:23:38Z
dc.date.available	2021-10-27T14:23:38Z
dc.date.issued	2019
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/33629
dc.source.conference	ASML Technology Conference 2019 's Hertogenbosch
dc.source.conferencedate	20/06/2019
dc.source.conferencelocation	's Hertogenbosch The Netherlands
dc.title	The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
dc.type	Oral presentation
dspace.entity.type	Publication
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