ESD process assessment of 2.5D and 3D bonding technologies

Abstract

Heterogeneous bonding technologies are an attractive way to assemble high performance computing systems today. However, ESD risks of 2.5D/3D bonding are not fully understood. To help ESD control engineers and tool manufacturers, this paper describes the 2.5D/3D bonding processes and gives practical insights into the relevant ESD process assessment steps.