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Conference contributions
ESD process assessment of 2.5D and 3D bonding technologies
Publication:
ESD process assessment of 2.5D and 3D bonding technologies
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Date
2023
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Simicic, Marko
;
Gijbels, Frank
;
Iacovo, Serena
;
Chen, Shih-Hung
;
Van der Plas, Geert
;
Beyne, Eric
Journal
N/A
Abstract
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999
since deposited on 2023-11-30
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Acq. date: 2026-02-28
Citations
Statistics
Views
999
since deposited on 2023-11-30
6
last month
2
last week
Acq. date: 2026-02-28
Citations