Publication:

ESD process assessment of 2.5D and 3D bonding technologies

Date

2023

Proceedings Paper

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Author(s)

;

;

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Chen, Shih-Hung

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Van der Plas, Geert

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Journal

N/A

Metrics

990 since deposited on 2023-11-30

2last month

Acq. date: 2025-12-15