Publication:

ESD process assessment of 2.5D and 3D bonding technologies

Date

2023
Proceedings Paper
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dc.contributor.authorSimicic, Marko
dc.contributor.authorGijbels, Frank
dc.contributor.authorIacovo, Serena
dc.contributor.authorChen, Shih-Hung
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSimicic, Marko
dc.contributor.imecauthorGijbels, Frank
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorChen, Shih-Hung
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSimicic, Marko::0000-0002-3623-1842
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecChen, Shih-Hung::0000-0002-6481-2951
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2024-03-21T14:02:18Z
dc.date.available2023-11-30T16:47:46Z
dc.date.available2024-03-21T14:02:18Z
dc.date.issued2023
dc.description.abstractHeterogeneous bonding technologies are an attractive way to assemble high performance computing systems today. However, ESD risks of 2.5D/3D bonding are not fully understood. To help ESD control engineers and tool manufacturers, this paper describes the 2.5D/3D bonding processes and gives practical insights into the relevant ESD process assessment steps.
dc.identifier.eisbn978-1-58537-347-5
dc.identifier.issn0739-5159
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43204
dc.publisherIEEE
dc.source.beginpage1
dc.source.conference45th Annual Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium
dc.source.conferencedateOCT 02-04, 2023
dc.source.conferencelocationRiverside
dc.source.journalN/A
dc.source.numberofpages21
dc.title

ESD process assessment of 2.5D and 3D bonding technologies

dc.typeProceedings paper
dspace.entity.typePublication
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