Publication:

The integration of a low-k material with high organic content in a non-etchback process

Date

1996
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorMeynen, Herman
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorGrillaert, Joost
dc.contributor.authorVan den hove, Luc
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorVan den hove, Luc
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-09-29T15:50:49Z
dc.date.available2021-09-29T15:50:49Z
dc.date.embargo9999-12-31
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1644
dc.source.beginpage75
dc.source.conferenceULSI XI : Advanced Metallization and Interconnect Systems for ULSI Applications
dc.source.conferencedate3/10/1995
dc.source.conferencelocationPortland, OR USA
dc.source.endpage80
dc.title

The integration of a low-k material with high organic content in a non-etchback process

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
984.pdf
Size:
229.62 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions