Publication:

Study of 3D process impact on advanced CMOS devices

Date

2013
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorGuo, Wei
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorSirignano, Emilio
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T09:01:45Z
dc.date.available2021-10-21T09:01:45Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22630
dc.source.beginpage1
dc.source.conferenceEuropean Microelectronics and Packaging Conference - EMPC
dc.source.conferencedate9/09/2013
dc.source.conferencelocationGrenoble France
dc.source.endpage7
dc.title

Study of 3D process impact on advanced CMOS devices

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions