Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Articles
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects
Publication:
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects
Date
2023
Journal article
https://doi.org/10.1109/TSM.2023.3311452
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jacobs, Kristof J. P.
;
Beyne, Eric
Journal
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Abstract
Description
Metrics
Views
887
since deposited on 2023-12-02
Acq. date: 2025-10-27
Citations
Metrics
Views
887
since deposited on 2023-12-02
Acq. date: 2025-10-27
Citations