Publication:

Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects

Date

2023
Journal article
https://doi.org/10.1109/TSM.2023.3311452
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dc.contributor.authorJacobs, Kristof J. P.
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJacobs, Kristof J. P.
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.date.accessioned2024-03-11T10:20:28Z
dc.date.available2023-12-02T16:54:11Z
dc.date.available2024-03-11T10:20:28Z
dc.date.issued2023
dc.identifier.doi10.1109/TSM.2023.3311452
dc.identifier.issn0894-6507
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43207
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage673
dc.source.endpage675
dc.source.issue4
dc.source.journalIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
dc.source.numberofpages3
dc.source.volume36
dc.title

Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects

dc.typeJournal article
dspace.entity.typePublication
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