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Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
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Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
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Date
2014
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kaur, Kamalpreet
;
Missinne, Jeroen
;
Van Steenberge, Geert
Journal
Applied Physics Letters
Abstract
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1888
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Acq. date: 2025-12-15
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Metrics
Views
1888
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-15
Citations