Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

dc.contributor.author	Kaur, Kamalpreet
dc.contributor.author	Missinne, Jeroen
dc.contributor.author	Van Steenberge, Geert
dc.contributor.imecauthor	Kaur, Kamalpreet
dc.contributor.imecauthor	Missinne, Jeroen
dc.contributor.imecauthor	Van Steenberge, Geert
dc.contributor.orcidimec	Missinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimec	Van Steenberge, Geert::0000-0001-8574-1235
dc.date.accessioned	2021-10-22T02:30:22Z
dc.date.available	2021-10-22T02:30:22Z
dc.date.embargo	9999-12-31
dc.date.issued	2014
dc.identifier.issn	0003-6951
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/24037
dc.identifier.url	http://scitation.aip.org/content/aip/journal/apl/104/6/10.1063/1.4864406
dc.source.beginpage	61102
dc.source.issue	6
dc.source.journal	Applied Physics Letters
dc.source.volume	104
dc.title	Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
dc.type	Journal article
dspace.entity.type	Publication
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