Publication:

Exploring W-Cu hybrid dual damascene metallization for future nodes

Date

2021
Proceedings Paper
https://doi.org/10.1109/IITC51362.2021.9537410
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dc.contributor.authorLei, W.
dc.contributor.authorPethe, S.
dc.contributor.authorHwang, S.
dc.contributor.authorChen, F.
dc.contributor.authorWu, Z.
dc.contributor.authorMachillot, J.
dc.contributor.authorCockburn, A.
dc.contributor.authorJansen, A.
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorHeylen, Nancy
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorLariviere, Stephane
dc.contributor.authorPark, Seongho
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorLariviere, Stephane
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.date.accessioned2022-05-05T09:10:06Z
dc.date.available2022-05-05T02:17:28Z
dc.date.available2022-05-05T09:10:06Z
dc.date.issued2021
dc.identifier.doi10.1109/IITC51362.2021.9537410
dc.identifier.eisbn978-1-7281-7632-1
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39744
dc.publisherIEEE
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC)
dc.source.conferencedateJUL 06-09, 2021
dc.source.conferencelocationVirtual
dc.source.journalna
dc.source.numberofpages3
dc.title

Exploring W-Cu hybrid dual damascene metallization for future nodes

dc.typeProceedings paper
dspace.entity.typePublication
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