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Reliability performance of advanced metallization options for 30nm ½ pitch in SiCOH low-k materials

Date

2011
Proceedings Paper
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dc.contributor.authorCroes, Kristof
dc.contributor.authorDemuynck, Steven
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorWilson, Chris
dc.contributor.authorHeylen, Nancy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-19T12:58:45Z
dc.date.available2021-10-19T12:58:45Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18751
dc.source.beginpageP1.5
dc.source.conferenceIEEE International Interconnect Technology Conference and Materials for Advanced Metallization - IITC/MAM
dc.source.conferencedate9/05/2011
dc.source.conferencelocationDresden Germany
dc.title

Reliability performance of advanced metallization options for 30nm ½ pitch in SiCOH low-k materials

dc.typeProceedings paper
dspace.entity.typePublication
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