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Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below

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dc.contributor.authorDecoster, Stefan
dc.contributor.authorCamerotto, Elisabeth
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorKundu, Souvik
dc.contributor.authorJurczak, Gosia
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorTokei, Zsolt
dc.contributor.authorLazzarino, Frederic
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorKundu, Souvik
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecKundu, Souvik::0000-0001-5815-8765
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2022-06-09T07:45:15Z
dc.date.available2022-05-22T02:19:06Z
dc.date.available2022-05-23T08:48:43Z
dc.date.available2022-06-09T07:45:15Z
dc.date.embargo2023-04-30
dc.date.issued2022-04-26
dc.description.wosFundingTextImec has received funding from the ECSEL Joint Undertaking (JU) under Grant Agreement No. 875999. The JU receives support from the European Union's Horizon 2020 research and innovation program and the Netherlands, Belgium, Germany, France, Austria, Hungary, United Kingdom, Romania, and Israel. Furthermore, we gratefully acknowledge the 300?mm Fab operations team at imec for their support, the thin films team for the growth of the metal layers, the X-SEM and TEM (EDX) metrology teams for providing high quality images and the colleagues at imec and at Lam Research for numerous discussions and much-appreciated feedback.
dc.identifier.doi10.1116/6.0001791
dc.identifier.issn2166-2746
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39869
dc.publisherA V S AMER INST PHYSICS
dc.source.beginpage032802
dc.source.issue3
dc.source.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
dc.source.numberofpages10
dc.source.volume40
dc.subject.disciplineApplied physics
dc.subject.keywordsRU
dc.subject.keywordsMO
dc.subject.keywordsDirect metal etch
dc.subject.keywordsMolybdenum
dc.subject.keywordsRuthenium
dc.subject.keywordsdry etch
dc.title

Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below

dc.typeJournal article
dspace.entity.typePublication
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