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Conference contributions
Establishing solder interconnects in capillary die-to-substrate self-assembly
Publication:
Establishing solder interconnects in capillary die-to-substrate self-assembly
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Date
2008
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Mastrangeli, Massimo
;
Ruythooren, Wouter
;
Van Hoof, Chris
;
Celis, Jean-Pierre
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1853
since deposited on 2021-10-17
Acq. date: 2026-01-08
Citations
Metrics
Views
1853
since deposited on 2021-10-17
Acq. date: 2026-01-08
Citations