Publication:
Establishing solder interconnects in capillary die-to-substrate self-assembly
Date
| dc.contributor.author | Mastrangeli, Massimo | |
| dc.contributor.author | Ruythooren, Wouter | |
| dc.contributor.author | Van Hoof, Chris | |
| dc.contributor.author | Celis, Jean-Pierre | |
| dc.contributor.imecauthor | Ruythooren, Wouter | |
| dc.contributor.imecauthor | Van Hoof, Chris | |
| dc.date.accessioned | 2021-10-17T08:53:09Z | |
| dc.date.available | 2021-10-17T08:53:09Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14137 | |
| dc.source.beginpage | 45 | |
| dc.source.conference | 3D System Integration Conference - 3D-SIC | |
| dc.source.conferencedate | 12/05/2008 | |
| dc.source.conferencelocation | Tokyo Japan | |
| dc.source.endpage | 55 | |
| dc.title | Establishing solder interconnects in capillary die-to-substrate self-assembly | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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