Publication:

Advanced metallization scheme for 3×50μm via middle TSV and beyond

Date

2015
Proceedings Paper
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dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorLi, Yunlong
dc.contributor.authorHeylen, Nancy
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorBrouri, Mohand
dc.contributor.authorGopinath, Sanjay
dc.contributor.authorNalla, Praveen
dc.contributor.authorThorum, Matthew
dc.contributor.authorMeshram, Prashant
dc.contributor.authorAnjos, Daniela M.
dc.contributor.authorYu, Jengyi
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T00:09:47Z
dc.date.available2021-10-23T00:09:47Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26073
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159573
dc.source.beginpage66
dc.source.conferenceIEEE 65th Electronic Components & Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage72
dc.title

Advanced metallization scheme for 3×50μm via middle TSV and beyond

dc.typeProceedings paper
dspace.entity.typePublication
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