Publication:

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Date

2011
Journal article
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dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLabie, Riet
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorVanstreels, Kris
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T13:10:18Z
dc.date.available2021-10-19T13:10:18Z
dc.date.issued2011
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18813
dc.source.beginpage1856
dc.source.endpage1859
dc.source.issue9_11
dc.source.journalMicroelectronics Reliability
dc.source.volume51
dc.title

Cu pumping in TSVs: Effect of pre-CMP thermal budget

dc.typeJournal article
dspace.entity.typePublication
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