Publication:

Low-damage damascene patterning of SiOC(H) low-k dielectrics

Date

2005-06
Proceedings Paper
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dc.contributor.authorStruyf, Herbert
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorIacopi, Francesca
dc.contributor.authorRichard, Olivier
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-16T05:31:53Z
dc.date.available2021-10-16T05:31:53Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11289
dc.source.beginpage30
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate6/06/2005
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage32
dc.title

Low-damage damascene patterning of SiOC(H) low-k dielectrics

dc.typeProceedings paper
dspace.entity.typePublication
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