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Moisture related low-k dielectric reliability before and after thermal annealing
Publication:
Moisture related low-k dielectric reliability before and after thermal annealing
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Date
2007
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Yunlong
;
Ciofi, Ivan
;
Carbonell, Laure
;
Groeseneken, Guido
;
Maex, Karen
;
Tokei, Zsolt
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1845
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Acq. date: 2025-12-15
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Views
1845
since deposited on 2021-10-16
1
last month
1
last week
Acq. date: 2025-12-15
Citations