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Moisture related low-k dielectric reliability before and after thermal annealing

Date

2007
Proceedings Paper
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dc.contributor.authorLi, Yunlong
dc.contributor.authorCiofi, Ivan
dc.contributor.authorCarbonell, Laure
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorMaex, Karen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.accessioned2021-10-16T17:28:06Z
dc.date.available2021-10-16T17:28:06Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12478
dc.source.beginpage405
dc.source.conference45th IEEE International Reliability Physics Symposium Proceedings - IRPS
dc.source.conferencedate14/04/2007
dc.source.conferencelocationPhoenix, AZ USA
dc.source.endpage409
dc.title

Moisture related low-k dielectric reliability before and after thermal annealing

dc.typeProceedings paper
dspace.entity.typePublication
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