Publication:

Mechanical issues of Cu to Cu wire bonding

Date

2004-09

Journal article

Simple item page Full metadata Statistics

Author(s)

;

Degryse, Dominiek

;

;

De Wolf, Ingrid

Journal

IEEE Trans. Components and Packaging Technologies

Statistics

1986 since deposited on 2021-10-15

Acq. date: 2026-01-25