Publication:
Mechanical issues of Cu to Cu wire bonding
Date
| dc.contributor.author | Chen, Jian | |
| dc.contributor.author | Degryse, Dominiek | |
| dc.contributor.author | Ratchev, Petar | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-15T12:51:05Z | |
| dc.date.available | 2021-10-15T12:51:05Z | |
| dc.date.issued | 2004-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8672 | |
| dc.source.beginpage | 539 | |
| dc.source.endpage | 545 | |
| dc.source.issue | 3 | |
| dc.source.journal | IEEE Trans. Components and Packaging Technologies | |
| dc.source.volume | 27 | |
| dc.title | Mechanical issues of Cu to Cu wire bonding | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |