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Conference contributions
Integration of electroless and electrolytic Cu and IC back end of line technologies
Publication:
Integration of electroless and electrolytic Cu and IC back end of line technologies
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Date
2000
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maex, Karen
;
Brongersma, Sywert
;
Lantasov, Yuri
;
Richard, Emmanuel
;
Palmans, Roger
;
Vervoort, Iwan
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1914
since deposited on 2021-10-14
Acq. date: 2026-01-25
Citations
Statistics
Views
1914
since deposited on 2021-10-14
Acq. date: 2026-01-25
Citations