Integration of electroless and electrolytic Cu and IC back end of line technologies

dc.contributor.author	Maex, Karen
dc.contributor.author	Brongersma, Sywert
dc.contributor.author	Lantasov, Yuri
dc.contributor.author	Richard, Emmanuel
dc.contributor.author	Palmans, Roger
dc.contributor.author	Vervoort, Iwan
dc.contributor.imecauthor	Maex, Karen
dc.contributor.imecauthor	Brongersma, Sywert
dc.contributor.orcidimec	Brongersma, Sywert::0000-0002-1755-3897
dc.date.accessioned	2021-10-14T13:18:46Z
dc.date.available	2021-10-14T13:18:46Z
dc.date.issued	2000
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/4551
dc.source.beginpage	71
dc.source.conference	Electrochemical Technology Applications in Electronics III
dc.source.conferencedate	17/10/1999
dc.source.conferencelocation	Honolulu, HI USA
dc.source.endpage	79
dc.title	Integration of electroless and electrolytic Cu and IC back end of line technologies
dc.type	Proceedings paper
dspace.entity.type	Publication
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