Publication:
Reduction of plasma process induced damage during gate poly etching by using the SiO2 hard maks
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1926 since deposited on 2021-09-30
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Acq. date: 2026-03-01
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Statistics
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1926 since deposited on 2021-09-30
2last month
1last week
Acq. date: 2026-03-01
Citations